Welcome to the SoftIE Project
SoftIE is a 3 year European Union funded Research and Innovation project aiming to solve the issue of a lack of reliable, conformable connector for electronic textile applications.
Nihesh Mohan, from SoftIE partner THI, recently presented his work at the IEEE Electronic Systems Integration Technology Conference ESTC in Helsinki, Finland (9-11 Sept)
He presented work from THI and partners titled:
Bio-manufacturing for Electronics: Integrating Sinterable Cu-complex Inks with Biodegradable PHB and PA-4 Bio-Synthesized Substrates
and
Adhesive-assisted Pressure-less Cu Bonding for SMD Applications
As part of this work he was awarded a prestigious Student Travel Grant from IEEE.
Recent Publications
Journal Link
Latest publications will appear here:
Coming Soon..
