SoftIE Consortium Members

University of Southampton (UoS) – Coordinator of the project and Work Package leader for 8 and 9 on Dissemination, Exploitation and Project Management.
Expertise in developing e-textile printing technologies, novel materials, printed inks and e-textile demonstrators.
Department website link: School of Electronics & Computer Science

Smart Textile Alliance – (STA) – Leader of work packages 1 &7 on Stakeholder consultation, requirements and standardisation.
A private not-for-profit organization promoting industry standards, collaboration, and use of e-textile technologies.
Company website link: https://smarttextilealliance.com/

Technische Universität Berlin – (TUB) – Description coming soon.

Ecole Nationale Supérieure des Arts et Industries Textiles – (ENS) – Description coming soon.

Technische Hochschule Ingolstadt – (THI) – Leader for Work Package 3, formulating and developing sustainable conductive materials for fabric interconnects. Deep expertise in conductive materials, printed electronics, and microelectronics packaging, with a focus on developing reliable and sustainable Cu-based materials, from MOD to micro- and nano-particle-based materials, for integration into smart textile applications.
Department website link: THI – Microelectronics Packaging

Applycon – (APL) – Description coming soon.

Specific Polymers – (SPol) – An independent French R&D company with more than 20 years of experience in organic, polymer and materials chemistry. Its current areas of work include sustainable materials, energy technologies, high-performance resins and composites, functional coatings, innovative adhesives, and foams. Within the SoftIE project, SPol is involved in Work Packages 2 and 3 and will work on the development of an encapsulation resin, a reversible and conductive adhesive and a reversible but non-conductive adhesive.
Company website link: https://specificpolymers.com/

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